Okay so. Some crazy thoughts.
1. Instead of fully 3d printing? Mount a thin unplated PCB as the print surface. Mesh that.
Minimizes print time as long as a good adhesion can be had. PETG-GF? Great adhesion to glass based materials, decent dielectric, and low shrinkage?
2. Re-mount with the mold fully pressed together with it. Re-mesh, obviously. Print again on the backside? Dual sided boards even!
If you start with a pre-drilled material, I don’t see why this can’t be used in multiple layers on each side with processing (soldering via, etc), and for more advanced circuits, like aluminium for heat dissipation, and other custom substrates. The key I think would be the choice of layer adhesives.
I imagine approaching this like multi-colour manual printing for attributes that may even be impossible to order.
